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High-NA EUV photomask effort targets 12-inch pilot line to cut chipmaking costs

Semiconductor equipment giant ASML and chipmaker TSMC are pushing the semiconductor industry toward 12-inch photomasks, a larger format that could make High-NA EUV lithography more productive and cost-effective for advanced chip manufacturing.The companies announced an industry-wide initiative on September 7 to develop the infrastructure needed for the transition. The effort targets a 12-inch mask pilot…